Mon, 15 Jul, 16:40 - 17:00
MO-A4.1P.9: Simulation of Thermodynamic Effect for Packaged Enclosures
Yan Peng, Kexin Song, Tiancheng Zhang, Huaguang Bao, Dazhi Ding, Nanjing University of Science and Technology, China; Jian Yang, Nanjing Solid State Devices Co, China