Yahui Ji, Chenye Zhang, Hao Gu, School of Integrated Circuits, Tsinghua University, China; Peiran Zhang, Department of Electronic Engineering, Tsinghua University, China; Jianle Liu, School of Integrated Circuits, Tsinghua University, China; Fan Yang, Department of Electronic Engineering, Tsinghua University, China; Tianxiang Nan, School of Integrated Circuits, Tsinghua University, China

YuChen Tong, Jing Hui Qiu, YAYUN CHENG, ZHE JIANG, Harbin Institute of Technology, China

Min Wang, Hao Chen, Chongqing University of Posts and Telecommunications, China; Nan Hu, Wenqing Xie, A-INFO Inc, China; Yang Hu, Chongqing University of Posts and Telecommunications, China; Zhengchuan Chen, Chongqing University, China

Oksana Manzhura, New Jersey Institute of Technology, United States; Ajay Poddar, Synergy Microwave Corp., 201 McLean Boulevard, Paterson, NJ, USA, United States; Durgamadhab Misra, New Jersey Institute of Technology, United States; Ulrich L Rohde, Synergy Microwave Corp., United States; James Breakall, Penn State University, United States

Youyou Zhao, Baoan Wu, Tao Li, China Nuclear Power Technology Research Institute Co.,Ltd, China; Shuxian Du, Yaxiu Sun, Dawei Zhang, Harbin Engineering University, China