Vincenzo Violi, University of Pisa/Università Mediterranea of Reggio Calabria, Italy; Danilo Brizi, University of Pisa, Italy; Tommaso Isernia, Università degli Studi Mediterranea di Reggio Calabria, Italy; Agostino Monorchio, University of Pisa, Italy

CheongMin Lee, Yonsei University, Korea (South); Sung Sil Cho, Ic-Pyo Hong, Kongju National University, Korea (South); Dongpil Park, Kim Youngju, DONGWOO FINE-CHEM, Korea (South); Jong-Gwan Yook, Yonsei University, Korea (South)

Deisy Formiga Mamedes, Jens Bornemann, University of Victoria, Canada; Alfredo Gomes Neto, Federal Institute of Paraiba, Brazil

Ye Han, Tao Fu, Nanjing University of posts and telecommunication, China

Shengchi Zhu, Southeast University, China; Di Gao, AVIC Research Institute for Special Structures of Aeronautical Composite, China; Zhenxin Cao, Southeast University, China

Yunshuai Gao, Yingsong Li, Luyu Zhao, Zhixiang Huang, Key Laboratory of Intelligent Computing and Signal Processing Ministry of Education, China; Eugene Sinkevich, Vladimir Mordachev, EMC R and D laboratory, Belarusian State University of Informatics and Radioelectronics, China

Ziyue Pan, Yikai Chen, Shiwen Yang, University of Electronic Science and Technology of China, China

Sundus Butt, National University of Sciences and Technology (NUST), Pakistan; Yiying Wang, Guilin University of Electronic Technology, China; Rana Sadaf Anwar, Muhammad M. Tahseen, National University of Sciences and Technology (NUST), Pakistan

Sundus Butt, Moazama Irfan, National University of Sciences and Technology (NUST), Pakistan; Yiying Wang, Guilin University of Electronic Technology, China; Rana Sadaf Anwar, Muhammad M. Tahseen, National University of Sciences and Technology (NUST), Pakistan